Invention Grant
- Patent Title: Method of manufacturing a sensor
- Patent Title (中): 制造传感器的方法
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Application No.: US09208924Application Date: 1998-12-10
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Publication No.: US06228275B1Publication Date: 2001-05-08
- Inventor: Daniel J. Koch , Jonathan H. Hammond , Daniel N. Koury, Jr. , Jonathan F. Gorrell
- Applicant: Daniel J. Koch , Jonathan H. Hammond , Daniel N. Koury, Jr. , Jonathan F. Gorrell
- Main IPC: H01L21302
- IPC: H01L21302

Abstract:
A sensor has a support substrate (200), an electrode (110, 510, 710) movable relative to a surface (201) of the support substrate (200) and comprised of a first material, a structure (160, 460, 560, 760) over a portion of the electrode (110, 510, 710) to limit mobility of the electrode (110, 510, 710) and comprised of a second material different from the first material, and bonding pads (170, 470) outside a perimeter of the electrode (110, 510, 710) and comprised of the second material.
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