发明授权
- 专利标题： Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate
- 专利标题（中）： 糊剂组合物，使用其的电路板，陶瓷生片，陶瓷基材和陶瓷多层基板的制造方法
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申请号： US09522149申请日： 2000-03-09
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公开(公告)号： US06183669B2公开(公告)日： 2001-02-06
- 发明人: Masahiro Kubota , Michiaki Iha , Shizuharu Watanabe
- 申请人： Masahiro Kubota , Michiaki Iha , Shizuharu Watanabe
- 优先权： JP11-081541 19990325; JP11-081543 19990325
- 主分类号： H01B120
- IPC分类号： H01B120
摘要：
There is disclosed a paste composition including (A) an organic binder comprising acidic functional groups; (B) an inorganic powder containing multivalent metal compounds; and (C) a mono-ol compound having a boiling point of about 178° C. or more. The paste composition enables various fine patterns such as via-holes with high precision, by suppressing gelation caused by mixing an organic binder having acidic functional groups and a compound containing multivalent metals.
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