Invention Grant
- Patent Title: Solid-state energy storage module employing integrated interconnect board
- Patent Title (中): 采用集成互连板的固态储能模块
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Application No.: US900427Application Date: 1997-07-25
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Publication No.: US6146778APublication Date: 2000-11-14
- Inventor: Jean Rouillard , Christophe Comte , Dominik Daigle , Ronald A. Hagen , Orlin B. Knudson , Andre Morin , Michel Ranger , Guy Ross , Roger Rouillard , Philippe St-Germain , Anthony Sudano , Thomas A. Turgeon
- Applicant: Jean Rouillard , Christophe Comte , Dominik Daigle , Ronald A. Hagen , Orlin B. Knudson , Andre Morin , Michel Ranger , Guy Ross , Roger Rouillard , Philippe St-Germain , Anthony Sudano , Thomas A. Turgeon
- Applicant Address: MN St. Paul CAX Montreal
- Assignee: 3M Innovative Properties Company,Hydro-Quebec Corporation
- Current Assignee: 3M Innovative Properties Company,Hydro-Quebec Corporation
- Current Assignee Address: MN St. Paul CAX Montreal
- Main IPC: H01M2/10
- IPC: H01M2/10 ; H01M2/20 ; H01M2/22 ; H01M2/34 ; H01M6/18 ; H01M6/50 ; H01M10/04 ; H01M10/48 ; H01M10/50 ; H05K1/11 ; H05K1/18
Abstract:
The present invention is directed to an improved electrochemical energy storage device. The electrochemical energy storage device includes a number of solid-state, thin-film electrochemical cells which are selectively interconnected in series or parallel through use of an integrated interconnect board. The interconnect board is typically disposed within a sealed housing which also houses the electrochemical cells, and includes a first contact and a second contact respectively coupled to first and second power terminals of the energy storage device. The interconnect board advantageously provides for selective series or parallel connectivity with the electrochemical cells, irrespective of electrochemical cell position within the housing. In one embodiment, a sheet of conductive material is processed by employing a known milling, stamping, or chemical etching technique to include a connection pattern which provides for flexible and selective interconnecting of individual electrochemical cells within the housing, which may be a hermetically sealed housing. Fuses and various electrical and electro-mechanical devices, such as bypass, equalization, and communication devices for example, may also be mounted to the interconnect board and selectively connected to the electrochemical cells.
Public/Granted literature
- US5296434A Soluble catalyst systems for the preparation of polyalk-1-enes having high molecular weights Public/Granted day:1994-03-22
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