发明授权
- 专利标题: Height reducible EMI shielded electronic enclosure
- 专利标题(中): 高可降容EMI屏蔽电子外壳
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申请号: US169329申请日: 1998-10-09
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公开(公告)号: US6111192A公开(公告)日: 2000-08-29
- 发明人: Dean P. Bell , Elizabeth D. Burke , Paul E. Case , Donald E. Johnston , Ronald L. McCord , Donald Stanulis , W. Jeffrey Sturgill
- 申请人: Dean P. Bell , Elizabeth D. Burke , Paul E. Case , Donald E. Johnston , Ronald L. McCord , Donald Stanulis , W. Jeffrey Sturgill
- 申请人地址: VA Marion
- 专利权人: Marion Composites
- 当前专利权人: Marion Composites
- 当前专利权人地址: VA Marion
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
An EMI shielded collapsible enclosure includes an upper enclosure half having a top wall connecting a surrounding upper sidewall, the top wall and upper sidewall being adapted to provide EMI resistance. A lower enclosure half has a bottom wall connecting a surrounding sidewall, the bottom wall and lower sidewall being adapted to provide EMI resistance. The upper sidewall and lower sidewall are of similar shape, with one smaller than the other to be telescopically received therein. Actuators are operatively associated with the upper enclosure half and the lower enclosure half for selectively extending or retracting the enclosure halves between a transport mode and an operational mode, an interior space defined by the upper enclosure half and the lower enclosure half being substantially larger in the operational mode.
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