Invention Grant
US6056761A System for detaching an occlusive device within a body using a
solderless, electrolytically severable joint
失效
用于使用无焊料，可分解电解的接头来拆卸身体内的闭塞装置的系统
- Patent Title: System for detaching an occlusive device within a body using a solderless, electrolytically severable joint
- Patent Title (中): 用于使用无焊料，可分解电解的接头来拆卸身体内的闭塞装置的系统
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Application No.: US743494Application Date: 1996-11-04
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Publication No.: US6056761APublication Date: 2000-05-02
- Inventor: Son Gia , Hong Doan , Pete Phong Pham , Ivan Sepetka , U. Hiram Chee , Michael Mariant , David Kupiecki
- Applicant: Son Gia , Hong Doan , Pete Phong Pham , Ivan Sepetka , U. Hiram Chee , Michael Mariant , David Kupiecki
- Applicant Address: CA Fremont
- Assignee: Target Therapeutics, Inc.
- Current Assignee: Target Therapeutics, Inc.
- Current Assignee Address: CA Fremont
- Main IPC: A61F2/82
- IPC: A61F2/82 ; A61B17/00 ; A61B17/12 ; A61F2/06 ; A61F2/84 ; A61B17/08
Abstract:
A solderless sacrificial link between a detachable member which is placed at and is intended to remain at a desired site within the mammalian body and the core wire used to introduce the detachable member. The detachable member device may be one used to create emboli in the vascular system or may be of any other type deliverable into the human body and detached into an ionic aqueous environment, either for later removal or permanent placement.
Public/Granted literature
- US6123714A System for detaching an occlusive device within a body using a solderless, electrolytically severable joint Public/Granted day:2000-09-26
Information query
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