发明授权
US5997810A High-strength copper based alloy free from smutting during pretreatment
for plating
失效
高强度铜基合金在电镀预处理过程中不发生裂纹
- 专利标题： High-strength copper based alloy free from smutting during pretreatment for plating
- 专利标题（中）： 高强度铜基合金在电镀预处理过程中不发生裂纹
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申请号： US949280申请日： 1997-10-13
-
公开(公告)号： US5997810A公开(公告)日： 1999-12-07
- 发明人: Rensei Futatsuka , Junichi Kumagai , Shunichi Chiba
- 申请人： Rensei Futatsuka , Junichi Kumagai , Shunichi Chiba
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Shindoh Co., Ltd.
- 当前专利权人： Mitsubishi Shindoh Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-225730 19950810
- 主分类号： C22C9/02
- IPC分类号： C22C9/02 ; C22C9/06
摘要：
A high-strength Cu based alloy, consists of:Ni: 0.5 to 2.0%;Sn: 1.2 to 2.5%;Si: 0.04 to 0.1%;Zn: 0.1 to 1%;Mg: 0.0001 to 0.02%;Mn: 0.0001 to 0.1%;P: 0.0001 to 0.02%; andCu and inevitable impurities: the balance,wherein the total content of Mg, Mn and P is 0.001 to 0.12%. The Cu based alloy is suitable for use as a material of electrical and electronic parts, and free from smutting during pretreatment for plating thereof.
公开/授权文献
- US5337414A Mass data storage and retrieval system 公开/授权日：1994-08-09
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