Integrated circuit-compatible photo detector device and fabrication
process
Abstract:
An integrated circuit-compatible photo detector is disclosed which is particularly compatible with BiCMOS fabrication processes. In a first aspect, the photo detector is formed as a lateral phototransistor having a semiconductor substrate, a base structure formed as a first impurity region in the substrate, an emitter structure formed as a second impurity region in the first impurity region, and a collector structure formed by the substrate and by a pair of third and fourth impurity regions in the substrate on opposite sides of the first and second impurity regions. An emitter contact is electrically connected to the second impurity region, while a pair of collector contacts are electrically connected to the third and fourth impurity regions and to each other. An anti-reflective coating is applied to at least the base structure. Advantageously, if a photodiode is required instead of a phototransistor, the second impurity region can be formed with the same polarity as the first impurity region, in which case the first and second impurity regions form a cathode (or anode) and the third and fourth impurity regions form an anode (or cathode). In a second aspect, the photo detector is formed as a lateral phototransistor having a semiconductor substrate, a base structure formed by the substrate, an emitter structure formed as a first impurity region in the substrate, and a collector structure formed as a pair of second and third impurity regions in the substrate on opposite sides of the first impurity region. An emitter contact is electrically connected to the first impurity region, while a pair of collector contacts are electrically connected to the second and third impurity regions and to each other. An anti-reflective coating is applied to at least the base structure. Advantageously, if a photodiode is required instead of a phototransistor, the first impurity region can be formed with the same polarity as the substrate, in which case the substrate and the first impurity region form an anode (or cathode) and the second and third impurity regions form a cathode (or anode).
Public/Granted literature
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IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L31/00 对红外辐射、光、较短波长的电磁辐射,或微粒辐射敏感的,并且专门适用于把这样的辐射能转换为电能的,或者专门适用于通过这样的辐射进行电能控制的半导体器件;专门适用于制造或处理这些半导体器件或其部件的方法或设备;其零部件(H01L51/42优先;由形成在一共用衬底内或其上的多个固态组件,而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00)
H01L31/08 .其中的辐射控制通过该器件的电流的,例如光敏电阻器
H01L31/10 ..特点在于至少有一个电位跃变势垒或表面势垒的,例如光敏晶体管
H01L31/101 ...对红外、可见或紫外辐射敏感的器件
H01L31/11 ....以两个势垒或面垒为特征的,如双极光晶体管
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