A method and an apparatus for interconnection of modular electronic components are provided. At least one foot is located on the bottom side of a component for providing mechanical support to the component. At least one receptacle is located on the top side of the component. The size and number of the receptacles correspond to the size and number of the feet. The feet contain at least one electrical connector. When multiple components are stacked, the receptacles of the lower component accept the corresponding feet and electrical connectors of the upper component thereby forming an electrical connection. The modular electronic components comprise computer components and stereo system components. The electrical connections comprise power connections and signaling connections.