发明授权
- 专利标题： Patch preparations for treating plants
- 专利标题（中）： 用于处理植物的补片制剂
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申请号： US610789申请日： 1996-03-11
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公开(公告)号： US5866141A公开(公告)日： 1999-02-02
- 发明人: Kakuji Tojo , Yuzuru Wada , Yuichi Otsu , Kunihiro Isono , Shinzaburo Sone , Katsuhiko Hanaki
- 申请人： Kakuji Tojo , Yuzuru Wada , Yuichi Otsu , Kunihiro Isono , Shinzaburo Sone , Katsuhiko Hanaki
- 申请人地址： JPX Tokyo
- 专利权人： Nihon Bayer Agrochem K.K.
- 当前专利权人： Nihon Bayer Agrochem K.K.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-081994 19950315
- 主分类号： A01G7/06
- IPC分类号： A01G7/06 ; A01M1/20 ; A01M7/00 ; A01N25/34 ; A01N43/40 ; A61K9/70
摘要：
The following invention introduces a patch preparation for treating plants, whereas the patch preparations comprise a chemical layer composed of at least one agrochemically active compound, at least one adhesive and optionally, one or more additives. The components are dispersed in a matrix state on a substrate which are then introduced on the roots of the plant to be treated.
公开/授权文献
- US4709052A Soil disease-controlling imides 公开/授权日：1987-11-24
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