- 专利标题： Ternary solder for the enhancement of C-4 fatigue life
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申请号： US687272申请日： 1996-07-25
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公开(公告)号： US5831336A公开(公告)日： 1998-11-03
- 发明人: Giulio DiGiacomo
- 申请人： Giulio DiGiacomo
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： B23K35/26
- IPC分类号： B23K35/26 ; C22C11/06 ; H01L21/60 ; H05K3/34 ; H01L23/48
摘要：
An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A method for using the solder to make electronic components and electric components made using the method are also provided.
公开/授权文献
- US5183897A Certain intermediate imino-substituted pyridines 公开/授权日：1993-02-02
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