Invention Grant
US5814062A Implant delivery assembly with expandable coupling/decoupling mechanism
失效
具有可扩张联轴器/解耦机构的植入物输送组件
- Patent Title: Implant delivery assembly with expandable coupling/decoupling mechanism
- Patent Title (中): 具有可扩张联轴器/解耦机构的植入物输送组件
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Application No.: US363264Application Date: 1994-12-22
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Publication No.: US5814062APublication Date: 1998-09-29
- Inventor: Ivan Sepetka , U. Hiram Chee
- Applicant: Ivan Sepetka , U. Hiram Chee
- Applicant Address: CA Fremont
- Assignee: Target Therapeutics, Inc.
- Current Assignee: Target Therapeutics, Inc.
- Current Assignee Address: CA Fremont
- Main IPC: A61F2/82
- IPC: A61F2/82 ; A61B17/12 ; A61F2/06 ; A61F2/84 ; A61M29/00
Abstract:
An occlusive implant delivery assembly includes a rapid response decoupling or detachment mechanism that does not effect significant migration of the implant during release. The assembly includes an occlusive implant device, such as an embolic coil, a pusher or device to carry the implant to the selected location, and an expandable coupling-decoupling mechanism for releasing the implant at the selected site. The mechanical construction provides rapid release times. In addition, the releasing mechanism generally operates without exerting any significant force on the implant, thereby avoiding any significant displacement of the implant during release.
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