Invention Grant
US5811355A Enhanced chemical-mechanical polishing (E-CMP) method of forming a
planar surface on a thin film magnetic head to avoid pole recession
失效
在薄膜磁头上形成平面的增强化学机械抛光（E-CMP）方法，以避免极点衰退
- Patent Title: Enhanced chemical-mechanical polishing (E-CMP) method of forming a planar surface on a thin film magnetic head to avoid pole recession
- Patent Title (中): 在薄膜磁头上形成平面的增强化学机械抛光（E-CMP）方法，以避免极点衰退
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Application No.: US741838Application Date: 1996-10-31
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Publication No.: US5811355APublication Date: 1998-09-22
- Inventor: Stephen G. Jordan
- Applicant: Stephen G. Jordan
- Applicant Address: JPX Tokyo
- Assignee: AIWA Co., Ltd.
- Current Assignee: AIWA Co., Ltd.
- Current Assignee Address: JPX Tokyo
- Main IPC: B23H5/08
- IPC: B23H5/08 ; G11B5/187 ; G11B5/31 ; B44C1/22
Abstract:
A method of enhanced chemical-mechanical polishing (E-CMP) utilizes an oxygen-rich liquid etchant in an abrasive slurry to form a substantially planar surface on a thin film magnetic head to substantially avoid pole recession. Illumination of the thin film magnetic head with ultraviolet light during E-CMP polishing greatly enhances the effect of the oxygen-rich etchant.
Public/Granted literature
- US4635587A Method and apparatus for detecting standing heat in cattle Public/Granted day:1987-01-13
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