发明授权
- 专利标题: Polysilicon grown by pulsed rapid thermal annealing
- 专利标题(中): 通过脉冲快速热退火生长的多晶硅
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申请号: US685728申请日: 1996-07-24
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公开(公告)号: US5773329A公开(公告)日: 1998-06-30
- 发明人: Yue Kuo
- 申请人: Yue Kuo
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/268 ; H01L21/336 ; H01L29/417 ; H01L29/423 ; H01L29/786
摘要:
A method of low temperature and rapid silicon crystallization or rapid transformation of amorphous silicon to high quality polysilicon over a large area is disclosed using a pulsed rapid thermal annealing (PRTA) method and a metal seed layer. The PRTA method forms polysilicon thin film transistors (TFTs) with a high throughput, on low temperature and large area glass substrates. The PRTA method includes the steps of forming over a glass layer a tri-layer structure having a layer of amorphous silicon sandwiched between bottom and top dielectric layers; selectively etching the top dielectric layer to expose portions of the amorphous silicon layer; forming a metal seed layer over the exposed portions of the amorphous silicon layer; and pulsed rapid thermal annealing using successive pulses separated by rest periods to transform the amorphous silicon layer to a polysilicon layer. In an alternate PRTA method, instead of forming the tri-layer structure, a bi-layer structure is formded over the glass layer. The bi-layer structure does not have the top dielectric layer of the tri-layer structure. The bi-layer structure includes dielectric and amorphous silicon layers.
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