A photo-sensitive resin composition is provided which contains (1) a particulate polymer of a carboxy-group-containing-diene having a cross-linked structure; (2) a polymer having two or more photo-polymerizable unsaturated groups at its molecular chain terminals, and, optionally, a photo-polymerizable unsaturated group, carboxyl group, hydroxy group, amino group, or epoxy group in side chains, or (2') a non-diene-type polymer having a photo-polymerizable unsaturated group, carboxyl group, hydroxy group, amino group, or epoxy group in side chains, or a low molecular weight linear diene-type polymer; (3) a photo-polymerizable unsaturated monomer; (4) a polymer containing an amino group; and (5) a photo-polymerization initiator. The photo-sensitive resin composition has excellent water-developing capability and shows almost no swelling in water, causing minimal reduction in strength and only minimal dimensional changes during development. Resin plates prepared from the composition possess excellent strength after exposure to light, excellent elongation at break, impact resilience and superb transparency, providing a good characteristic balance of properties.