Disclosed is a frame-supported pellicle, which is an integral body consisting of a rigid frame and a transparent plastic film adhesively bonded to one end surface of the frame in a slack-free fashion, for dustproof protection of a photomask used in a photolithographic patterning work in the manufacture of fine electronic devices such as LSIs and liquid crystal display panels. The frame-supported pellicle is prepared by bonding the frame and plastic film with an adhesive having a glass transition temperature substantially lower than that of the polymeric resin forming the film and the adhesive bonding work is performed at a temperature higher than the glass transition temperature of the adhesive but lower than that of the polymeric resin of the film so that excellent adhesive bonding strength can be obtained between the frame and the resin film still without causing any adverse influences on the resin film such as distortion and crease formation.