Invention Grant
US5672551A Method for manufacturing a semiconductor pressure sensor with single-crystal silicon diaphragm and single-crystal gage elements 失效
制造具有单晶硅膜片和单晶计量元件的半导体压力传感器的方法

  • Patent Title: Method for manufacturing a semiconductor pressure sensor with single-crystal silicon diaphragm and single-crystal gage elements
  • Patent Title (中): 制造具有单晶硅膜片和单晶计量元件的半导体压力传感器的方法
  • Application No.: US462176
    Application Date: 1995-06-05
  • Publication No.: US5672551A
    Publication Date: 1997-09-30
  • Inventor: Clifford D. Fung
  • Applicant: Clifford D. Fung
  • Applicant Address: MA Foxboro
  • Assignee: The Foxboro Company
  • Current Assignee: The Foxboro Company
  • Current Assignee Address: MA Foxboro
  • Main IPC: G01L9/00
  • IPC: G01L9/00 H01L21/77
Method for manufacturing a semiconductor pressure sensor with
single-crystal silicon diaphragm and single-crystal gage elements
Abstract:
A semiconductor pressure sensor utilizes single-crystal silicon piezoresistive gage elements dielectrically isolated by silicon oxide from other such elements, and utilizes an etched silicon substrate with an etch stop. P-type implants form p-type piezoresistive gage elements and form p+ interconnections to connect the sensor to external electrical devices. The diaphragm is made from epitaxially-grown single-crystal silicon. Passivation nitride can be used for additional dielectric isolation. One practice of the invention provides over-range cavity protection, and thus increased robustness, by forming an over-range stop for the diaphragm through localized oxygen ion implantation and etching.
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