Invention Grant
- Patent Title: Method for manufacturing semiconductor devices
- Patent Title (中): 制造半导体器件的方法
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Application No.: US353206Application Date: 1994-12-01
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Publication No.: US5563095APublication Date: 1996-10-08
- Inventor: Jeffrey Frey
- Applicant: Jeffrey Frey
- Assignee: Frey; Jeffrey
- Current Assignee: Frey; Jeffrey
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/22
Abstract:
A method of continuous manufacture of semiconductor integrated circuits, said method and apparatus adapted to contain the semiconductor substrate, semiconductor deposition coating processes, and etching processes within a substantially collocated series of process chambers so that the semiconductor travels from one chamber to the next without exposure to airborne impurities and contact with manufacturing personnel. The invention has particular utility in the high volume fabrication of large surface area semiconductor circuits such as active matrix liquid crystal displays. The present invention contains a roll-to-roll and continuous belt embodiment.
Public/Granted literature
- US4915780A Process for making an element for microwave heating Public/Granted day:1990-04-10
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