A plurality of electrostatic discharge protection devices are disclosed for use with semiconductor chip packaging such as surface mount chip packages wherein the electrostatic discharge protection devices have shorting arms that extend outward from the electrostatic discharge protection device to make contact with connector pins on the semiconductor chip package such that an electrical connection is made between all of the connector pins of the semiconductor chip package thereby creating a short circuit across the connector pins of the semiconductor chip package to protect the semiconductor chip package from electrostatic discharge. In one embodiment, the electrostatic discharge protection device automatically withdraws the shorting connection upon insertion of the semiconductor chip package onto a printed circuit board. In other embodiments the electrostatic discharge protection device is manually operated to remove the short upon mechanical movement of the device.