An electroforming/electrodeposition process and apparatus includes a first electrode, a second electrode spaced from the first electrode, a channel defined by the first and second electrodes and at least one electrically nonconductive or poorly conductive shield disposed adjacent at least one electrode. The shield(s) define(s) a region of the channel wherein the surface of a mandrel placed in that region experiences substantially uniform current density. The apparatus may contain additional electroforming/electrodeposition and/or other steps and may be arranged in a carousel apparatus with one or more mandrels to permit continuous operation of the apparatus.