A method is provided for manufacturing a composite conductor having a copper or copper alloy core, a conductive ceramic intermediate layer and a nickel outer layer, and being suitable for high temperature applications. The method involves first preparing the copper or copper alloy core, then extruding a mixture of conductive ceramic power and a binder around the core to form the ceramic layer, and then applying a nickel tape as an outer covering. As further steps, a seam of the nickel tape covering is welded, the product is passed through a cladding die, and finally the product is drawn to form the desired conductor with a preselected diameter. Optionally, a further ceramic layer can be applied around the nickel layer.