Invention Grant
- Patent Title: Laser ablation apparatus
- Patent Title (中): 激光消融装置
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Application No.: US350734Application Date: 1994-12-07
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Publication No.: US5446755APublication Date: 1995-08-29
- Inventor: Yoshikazu Yoshida , Shinichi Mizuguchi
- Applicant: Yoshikazu Yoshida , Shinichi Mizuguchi
- Applicant Address: JPX Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JPX Osaka
- Priority: JPX5-35101 19930224
- Main IPC: B23K26/08
- IPC: B23K26/08 ; B23K26/12 ; H01S3/00
Abstract:
A laser ablation apparatus includes a laser oscillator, a condenser lens for condensing a laser light generated from the oscillator, a rotary cylindrical target having a side face which is illuminated by the laser light, a driving device for rotating the target, a substrate carrier device for moving a substrate in a direction parallel to a tangential direction of the cylindrical target, and a vacuum chamber located above the substrate. The vacuum chamber encloses a part of the cylindrical target, and has an open laser inlet port so that the side face of the target is illuminated by the laser light passing through the laser inlet port to adhere material evaporated from the target to the substrate when the substrate passing through the vacuum chamber.
Public/Granted literature
- US6166564A Control circuit for clock enable staging Public/Granted day:2000-12-26
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