Invention Grant
- Patent Title: High impact strength polymer blends
- Patent Title (中): 高冲击强度聚合物共混物
-
Application No.: US992259Application Date: 1992-12-14
-
Publication No.: US5380797APublication Date: 1995-01-10
- Inventor: Werner Siol , Jens-Dieter Fischer , Ulrich Terbrack , Klaus Koralewski
- Applicant: Werner Siol , Jens-Dieter Fischer , Ulrich Terbrack , Klaus Koralewski
- Applicant Address: DEX Darmstadt
- Assignee: Rohm GmbH Chemische Fabrik
- Current Assignee: Rohm GmbH Chemische Fabrik
- Current Assignee Address: DEX Darmstadt
- Priority: DEX4141319 19911214
- Main IPC: C08L51/00
- IPC: C08L51/00 ; C08L51/04 ; C08L51/06
Abstract:
This invention relates to high impact strength polymer blends containing at least two two-phase or multiphase polymers P1 and P2, which in turn contain at least one toughening phase A1 or A2 and at least one hardness phase B1 or B2. B1 and B2 differ in chemical structure and are thermodynamically compatible with one another. The polymer blend optionally contains another thermoplastic polymer B'3 and/or another two-phase or multiphase polymer P4 contain at least one toughening phase A4 and at least one hardness phase B4, provided that B'3 and/or B4 are different from B1 and B2 and are thermodynamically compatible with B1 and B2.
Public/Granted literature
- US5920118A Chip-size package semiconductor Public/Granted day:1999-07-06
Information query