Apparatus for making an electrical interconnection between first and second, parallel, spaced apart, circuit bearing, substrates or boards and a flex circuit formed on a flexible film. At least one of the substrates or boards has at least one terminal pad formed on the surface thereof, and the flex circuit has at least one terminal pad formed on a surface thereof through an assembly. The apparatus includes resilient, elastomeric spacer means for being positioned between and cushioning the spaced apart, circuit bearing, substrates or boards at least adjacent the terminal pad on the at least one substrate of board and retainer means for compressing the elastomeric spacer means between the first and second, parallel, spaced apart, circuit bearing, substrates or boards and against the flexible circuit. The flexible circuit terminal pad overlies and is in contact with the terminal pad on the at least one printed circuit bearing substrate or board.