Silicone compositions comprising an organopolysiloxane composition and an organic compound capable of coordination with metals are described. Since the organic compound is preferentially adsorbed on a metal surface, the composition is particularly suitable for use in electric or electronic parts to prevent contact failure. A more specific embodiment comprises a diorganopolysiloxane of the average unit formula, R.sub.a SiO.sub.(4-a)/2, wherein each R independently represents an unsubstituted or substituted monovalent hydrocarbon group, and a is a value of from 1.90 to 2.05, a filler, an alkoxysilane or its hydrolyzate, a silylation catalyst made of an organic silicon compound having at least one specific type of group, an organic tin compound, another organosilicon compound capable of reaction with an alcohol in order to stabilize the composition, and an organic compound capable of coordination with metals.