Invention Grant
US5183592A Electroconductive adhesive comprising an epoxy novolak resin and
phenol-aralkyl resin
失效
包含环氧酚醛清漆树脂和苯酚 - 芳烷基树脂的导电粘合剂
- Patent Title: Electroconductive adhesive comprising an epoxy novolak resin and phenol-aralkyl resin
- Patent Title (中): 包含环氧酚醛清漆树脂和苯酚 - 芳烷基树脂的导电粘合剂
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Application No.: US639020Application Date: 1991-01-09
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Publication No.: US5183592APublication Date: 1993-02-02
- Inventor: Nobuo Ichimura , Yauso Miyamoto , Mitsuo Yamazaki
- Applicant: Nobuo Ichimura , Yauso Miyamoto , Mitsuo Yamazaki
- Applicant Address: JPX Tokyo
- Assignee: Hitachi Chemical Company Ltd.
- Current Assignee: Hitachi Chemical Company Ltd.
- Current Assignee Address: JPX Tokyo
- Priority: JPX2-011635 19900119
- Main IPC: H01L21/58
- IPC: H01L21/58 ; C08G59/62 ; C08G59/68 ; C08L63/00 ; C09J9/02 ; C09J11/04 ; C09J161/06 ; C09J163/00 ; C09J163/04 ; H01B1/22
Abstract:
An electroconductive adhesive comprising an epoxy-novolak resin, a phenol-aralkyl resin, a glycidyl group-containing silane coupling agent, an organic borate and an electro-conductive metal power is excellent in reliability in moisture and hydrolytic resistance and useful for semiconductor devices.
Public/Granted literature
- US5772978A Process for producing tungsten oxide Public/Granted day:1998-06-30
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