发明授权
- 专利标题: Low profile receptacle terminal for soldering to a circuit board
- 专利标题(中): 用于焊接到电路板的低剖面插座端子
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申请号: US744095申请日: 1991-08-12
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公开(公告)号: US5131853A公开(公告)日: 1992-07-21
- 发明人: Kevin E. Meyer
- 申请人: Kevin E. Meyer
- 申请人地址: IN Kokomo
- 专利权人: Delco Electronics Corporation
- 当前专利权人: Delco Electronics Corporation
- 当前专利权人地址: IN Kokomo
- 主分类号: H01R4/02
- IPC分类号: H01R4/02 ; H01R12/58
摘要:
A low profile receptacle terminal of unitary construction includes an integral head portion with a perimeter wall of low profile; the perimeter wall has a plurality of integral spring contact fingers thereon each connected at one end to the perimeter wall and each having a free end thereon located within the perimeter wall and bent at an acute angle with respect to the upper edge of the perimeter wall so as to reduce the height of the head portion; the spring contact fingers have a free state position; the head portion is spaced from a gage can by a clearance that prevents electrical shorting between an electrical component and the receptacle terminal. Integral spring clips connect the receptacle terminal to the circuit board and the spring clips have a vertical dimension for solder flow to electrically connect the receptacle terminal to conductor strips on the circuit board without wicking solder to the spring contact fingers whereby the spring contact fingers will selectively engage and release a conductor pin of an electrical device connected to the component side of the circuit board.
公开/授权文献
- US4684563A Electrothermal transfer recording sheet 公开/授权日:1987-08-04
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