发明授权
- 专利标题： Method of forming fine patterns
- 专利标题（中）： 形成精细图案的方法
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申请号： US600765申请日： 1990-10-23
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公开(公告)号： US5100508A公开(公告)日： 1992-03-31
- 发明人: Yukimasa Yoshida , Isahiro Hasegawa
- 申请人： Yukimasa Yoshida , Isahiro Hasegawa
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX1-276014 19891025
- 主分类号： H01L21/3213
- IPC分类号： H01L21/3213 ; G03F7/00 ; G03F7/20 ; H01L21/027 ; H01L21/30
摘要：
Disclosed is a method of forming a fine pattern composed by repeating, at least once or more, a series of fine pattern forming process having the steps of coating a photoresist on a wafer, exposing a predetermined portion of the wafer through a reticle, carrying out a developing process after the exposure process, etching the wafer, and removing a resist remaining on the wafer, wherein different portions on the wafer are respectively exposed in the exposing process in the series of fine pattern forming process, and each portion once exposed in the process is not exposed again.
公开/授权文献
- US5676491A Buried pipe laying method 公开/授权日：1997-10-14
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