Invention Grant
- Patent Title: Double-sided backplane assembly
- Patent Title (中): 双面背板组装
-
Application No.: US467450Application Date: 1990-01-19
-
Publication No.: US5023754APublication Date: 1991-06-11
- Inventor: Conrad J. Aug , Wayne J. Casanova , William D. Corfits , Roger F. Dimmick , Stephen E. Wheeler
- Applicant: Conrad J. Aug , Wayne J. Casanova , William D. Corfits , Roger F. Dimmick , Stephen E. Wheeler
- Applicant Address: NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: NY Armonk
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H05K7/14
Abstract:
A double-sided backplane assembly is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card centrally located between a stiffener and an EMC shield affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.
Public/Granted literature
- US6166277A Process for evaporating 1,2-dichloroethane (EDC) Public/Granted day:2000-12-26
Information query