Invention Grant
US5023754A Double-sided backplane assembly 失效
双面背板组装

Double-sided backplane assembly
Abstract:
A double-sided backplane assembly is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card centrally located between a stiffener and an EMC shield affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.
Public/Granted literature
Information query
Patent Agency Ranking
0/0