A test clip is provided which has multiple contacts that can engage the leads of a surface mount integrated circuit device whose leads are very closely spaced, while being reliably held down to the circuit device during a test procedure. The test clip has a housing with a recess (72, FIG. 10) that very closely recieves the top of the body of the circuit device (12) to align the clip with the circuit device, the clip being devoid of engagement with the lower part of the device. Instead, the test clip relies solely on frictional engagement of its contacts (24) with the circuit device leads (64) to hold down the test clip. Each contact has a first part (80) that initially lies against a contact-locating outer surface (82) of the housing. Each contact also has a second part (84) that extends below the contact-locating outer surface and that is positioned to be outwardly deflected slightly as it wipes across a circuit device lead, as the test clip is moved directly downwardly against the circuit device.