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US4933299A Method of forming 3-D structures using MOVCD with in-situ photoetching 失效
使用具有原位光刻技术的MOVCD形成三维结构的方法

Method of forming 3-D structures using MOVCD with in-situ photoetching
Abstract:
MOVPE growth and photoetching are integrated into a unified sequence which is carried out without removing a workpiece from a MOVPE reactor. Growth may be carried out before, after or before and after the etching.To prevent pattern broadening by diffussion of the active species the substrate is preferably protected by a fugitive coating which is removed by the illumination. Native oxide coatings are particularly suitable for InGaAsP substrates. These are conveniently applied for exposing to substrate to 20.degree./o O.sub.2 +80.degree./oN.sub.2 for about 3 minutes at 450.degree. C.
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