Invention Grant
- Patent Title: Structured semiconductor body
- Patent Title (中): 结构半导体体
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Application No.: US941223Application Date: 1986-12-12
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Publication No.: US4912538APublication Date: 1990-03-27
- Inventor: Erich Kasper , Klaus Worner
- Applicant: Erich Kasper , Klaus Worner
- Applicant Address: DEX Frankfurt am Main DEX Heilbronn
- Assignee: Licentia Patent-Verwaltungs GmbH,Telefunken electronic GmbH
- Current Assignee: Licentia Patent-Verwaltungs GmbH,Telefunken electronic GmbH
- Current Assignee Address: DEX Frankfurt am Main DEX Heilbronn
- Priority: DEX3545244 19851220
- Main IPC: H01L21/203
- IPC: H01L21/203 ; H01L21/331 ; H01L21/763 ; H01L29/08 ; H01L29/732
Abstract:
A structured semiconductor body based on a Si substrate and having monocrystalline semiconductor regions and barrier regions which contain polycrystalline silicon which have preferably been produced in an Si-MBE process. The barrier regions are provided to delimit the monocrystalline Si semiconductor structures to prevent undesired current flow, for example between twso monocrystalline devices of an integrated circuit. The polycrystalline silicon of the barrier regions has a substantially lower electrical conductivity than the monocrystalline regions, and consequently it is possible to spatially selectively dope portions the barrier region so as to provide regions which electrically contact a monocrystalline silicon region. In a preferred embodiment a polycrystalline silicon region within the barrier region is doped so that it forms a pn-junction with the adjacent monocrystalline semiconductor region and can be used, for example, as an emitter zone of a bipolar device.
Public/Granted literature
- US5304937A Capacitive position sensor with an electrode array cursor and topographically featured scale Public/Granted day:1994-04-19
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