An easily removable high voltage ground stud insulative enclosure allows ready access to the ground stud bolt having one end directly attached to a switchgear terminal bus, with the other end adapted to receive a temporary ground connector. The removable part of the insulative enclosure consists of a thermoplastic insulative cylinder that is arranged over that part of the ground stud that is adapted for connection with the ground connector. The insulating properties of the thermoplastic material virtually eliminate arcing between the ground stud and the surrounding atmosphere when the switchgear is energized with high voltage.