发明授权
- 专利标题: Highly conductive copper-based alloy
- 专利标题(中): 高导电性铜基合金
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申请号: US22377申请日: 1987-03-05
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公开(公告)号: US4710349A公开(公告)日: 1987-12-01
- 发明人: Shinsuke Yamazaki , Rikio Takeda , Iwao Uda
- 申请人: Shinsuke Yamazaki , Rikio Takeda , Iwao Uda
- 申请人地址: JPX Tokyo
- 专利权人: Sumitomo Metal & Mining Co., Ltd.
- 当前专利权人: Sumitomo Metal & Mining Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX61-58024 19860318
- 主分类号: H01B1/02
- IPC分类号: H01B1/02 ; C22C9/00
摘要:
A highly conductive copper-based alloy containing 0.001 percent to 0.02 percent of tellurium, 0.05 percent to 0.3 percent of one element selected from iron and chromium, and 0 percent to 0.01 percent of phosphorous with the balance being copper and incidental impurities.
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