A printed circuit board support comprises an integral plastic molding having an elongated mounting portion adapted for insertion through an aperture in a mounting panel. The mounting portion has a head adapted to span a body adapted to be positioned inwardly of said panel, and abutment means for engaging the surface of a printed circuit board or the like. Resilient retaining means extending from the body yield resiliently upon insertion through said aperture and thereafter engage the back side of said panel. The support further has a retainer portion extending beyond the abutment means for insertion through an aperture in said printed circuit board and has resilient retaining means adapted to yield upon passage through the aperture in said printed circuit board and thereafter to bear against the opposite surface of said printed circuit board to retain said printed circuit board in supported position spaced from said panel.