发明授权
US4600137A Method and apparatus for mass soldering with subsequent reflow soldering
失效
随后的回流焊接的质量焊接方法和设备
- 专利标题： Method and apparatus for mass soldering with subsequent reflow soldering
- 专利标题（中）： 随后的回流焊接的质量焊接方法和设备
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申请号： US703735申请日： 1985-02-21
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公开(公告)号： US4600137A公开(公告)日： 1986-07-15
- 发明人: Matthias F. Comerford
- 申请人： Matthias F. Comerford
- 申请人地址： NH Nashua
- 专利权人： Hollis Automation, Inc.
- 当前专利权人： Hollis Automation, Inc.
- 当前专利权人地址： NH Nashua
- 主分类号： B23K1/08
- IPC分类号： B23K1/08 ; H05K3/30 ; H05K3/34 ; B23K31/02
摘要：
An improved apparatus and method for mass soldering electrical and electronic components populating both the top and bottom surfaces of substrate circuit boards or the like in a single pass is described. The circuit boards pass through a mass soldering station first, and after a timed interval the circuit boards pass through a solder reflow station. The timed interval allows heat transfer through the circuit boards to reach its maximum.
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