发明授权
US4600137A Method and apparatus for mass soldering with subsequent reflow soldering 失效
随后的回流焊接的质量焊接方法和设备

Method and apparatus for mass soldering with subsequent reflow soldering
摘要:
An improved apparatus and method for mass soldering electrical and electronic components populating both the top and bottom surfaces of substrate circuit boards or the like in a single pass is described. The circuit boards pass through a mass soldering station first, and after a timed interval the circuit boards pass through a solder reflow station. The timed interval allows heat transfer through the circuit boards to reach its maximum.
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