发明授权
- 专利标题: Room temperature curable polyorganosiloxane composition
- 专利标题(中): 室温固化型聚有机硅氧烷组合物
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申请号: US623275申请日: 1984-06-21
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公开(公告)号: US4537944A公开(公告)日: 1985-08-27
- 发明人: Takafumi Imai , Fumihiko Kobayashi
- 申请人: Takafumi Imai , Fumihiko Kobayashi
- 申请人地址: JPX Tokyo
- 专利权人: Toshiba Silicone Co., Ltd.
- 当前专利权人: Toshiba Silicone Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX58-125649 19830711
- 主分类号: C08L71/02
- IPC分类号: C08L71/02 ; C08K5/544 ; C08L83/00 ; C08L83/04 ; C08L83/06 ; C08L83/12 ; C08G77/06
摘要:
The present invention provides a room temperature curable polyorganosiloxane composition comprising:(A) 100 parts by weight in total of:(1) a polydiorganosiloxane of the general formula: ##STR1## (2) a silane of the general formula:R.sub.b.sup.3 Si(OR.sup.4).sub.4-b(B) 0.01 to 10 parts by weight of a curing catalyst;(C) 0.5 to 10 parts by weight of a nitrogen-containing silicon compound in which the nitrogen atom is bonded with a silicon atom through one or more carbon atoms and said nitrogen atom is further bonded directly with said silicon atom or another silicon atom; and(D) 0.05 to 50 parts by weight of a polyoxyalkylene chain-containing compound.
公开/授权文献
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