Interconnection apparatus for electrically connecting the contact areas (22) of a printed wiring board (20) and the contact springs (e.g., 33, 34) of a backplane (10) for increasing the board terminations without increasing the width of the board leading edge (21). A coordinate array of contact areas (22) is provided at least on one side of the leading portion of the board (20) which corresponds to an array of contacting surfaces of the springs (e.g., 33, 34) extending from a backplane (10). A mask (e.g., 23) having an array of apertures (24) corresponding to the contact area array overlies the leading portion (21) of the board (20). The mask apertures (e.g., 24) are individually dimensioned and formed within the array rows to accept therethrough only correspondingly formed individual contact springs (e.g., 33, 34) of the spring rows. Accordingly, as the board (20) is inserted in opposition to the contact springs, individual ones of the latter can only make electrical contact with their corresponding board (20) contact areas (22) when the board is fully inserted, the spring and contact area mating then occurring simultaneously.