发明授权
US4272140A Arrangement for mounting dual-in-line packaged integrated circuits to
thick/thin film circuits
失效
将双列直插封装集成电路安装到厚/薄膜电路的布置
- 专利标题： Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits
- 专利标题（中）： 将双列直插封装集成电路安装到厚/薄膜电路的布置
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申请号： US105180申请日： 1979-12-19
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公开(公告)号： US4272140A公开(公告)日： 1981-06-09
- 发明人: George S. Lychyk , Wayne E. Neese
- 申请人： George S. Lychyk , Wayne E. Neese
- 申请人地址： IL Northlake
- 专利权人： GTE Automatic Electric Laboratories Incorporated
- 当前专利权人： GTE Automatic Electric Laboratories Incorporated
- 当前专利权人地址： IL Northlake
- 主分类号： H05K3/30
- IPC分类号： H05K3/30 ; H05K3/34 ; H05K7/10 ; H05K1/12
摘要：
An arrangement for mounting a dual-in-line packaged integrated circuit (DIP) to a thick/thin film circuit wherein a portion of each DIP lead is formed into a U-shape including a horizontal foot portion. The arrangement further includes a complementary socket which accepts the U-shaped DIP leads in opposite sides thereof. The socket is then soldered to either a thick/thin film circuit of a circuit board.
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