Catalyst of cuprous chloride, as a first layer, on a carrier of particles of pyrogenic anhydrous silica or titania, or alpha-alumina produced from pyrogenic gamma-alumina, having as a second layer an alkali metal chloride especially KCl, and preferably also a rare earth metal chloride; especially LaCl.sub.3 ; formed by impregnation using non-aqueous solvents, especially CuCl in acetonitrile followed by KCl/LaCl.sub.3 in formic acid. The catalyst is effective at desirable reaction rates at temperatures well below 400.degree. C., such as 200.degree.-300.degree. C. and even below 200.degree. C., under certain conditions, for oxyhydrochlorination of organic materials such as methane; and is also effective for production of chlorine by the Deacon process at relatively low temperatures. Problems due to catalyst volatility and melting are substantially mitigated.