发明授权
US4104480A Semiconductive filling compound for power cable with improved properties
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具有改进性能的电力电缆用半导体填充料
- 专利标题: Semiconductive filling compound for power cable with improved properties
- 专利标题(中): 具有改进性能的电力电缆用半导体填充料
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申请号: US739315申请日: 1976-11-05
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公开(公告)号: US4104480A公开(公告)日: 1978-08-01
- 发明人: Paul F. Thompson
- 申请人: Paul F. Thompson
- 申请人地址: CT Greenwich
- 专利权人: General Cable Corporation
- 当前专利权人: General Cable Corporation
- 当前专利权人地址: CT Greenwich
- 主分类号: H01B7/282
- IPC分类号: H01B7/282 ; H01B7/285 ; H01B9/02 ; H01B13/24 ; H01B7/28
摘要:
This invention is an improved filling compound for preventing moisture penetration along the interior of high voltage electric power cables. Amorphous polypropylene, mixed with carbon where it must be semiconductive, is an extremely good filling compound because of its electrical characteristics and also because of its good flow characteristics when extruding. When the cable is to be used under conditions where it must withstand temperatures so low that the polypropylene becomes brittle, it can be blended with polyisobutylene rubber to withstand lower temperatures, but the blend must be kept within limits to prevent loss of the good flow characteristics of the amorphous polypropylene.
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