The invention relates to storage-stable, quick-curing epoxide resin moulding materials containing:A. pre-adducts containing aromatic constituents and free epoxide groups and formed from epoxide resins and polyamines,B. pre-adducts containing free amino groups and formed from polyamines containing cycloaliphatic or heterocyclic groups with polyglycidyl compounds, as curing agents, andC. mineral or organic pulverulent or fibrous fillers, with the epoxide resin pre-adducts and the curing agents softening between 45.degree. and 120.degree.C, and melting 5.degree. to 30.degree.C above the softening point, and the resin pre-adducts and the curing agents being present in the moulding materials predominantly in the form of particles separated from each other.The moulded articles are distinguished by very good stability to solar and UV rays, and retain their original colour to a very considerable extent even after prolonged irradiation.