Invention Grant
US3848021A Thermoplastic molding composition on the basis of poly(oxymethylenes)
失效
基于聚(甲基乙烯)的热塑性成型组合物
- Patent Title: Thermoplastic molding composition on the basis of poly(oxymethylenes)
- Patent Title (中): 基于聚(甲基乙烯)的热塑性成型组合物
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Application No.: US28272072Application Date: 1972-08-22
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Publication No.: US3848021APublication Date: 1974-11-12
- Inventor: SEXTRO G , BURG K
- Applicant: HOECHST AG
- Assignee: Hoechst AG
- Current Assignee: Hoechst AG
- Priority: DE2142091 1971-08-23
- Main IPC: C08L59/00
- IPC: C08L59/00 ; C08J3/20 ; C08L59/02 ; C08G37/02
Abstract:
1. PROCESS FOR THE MANUFACTURE OF A THERMOPLASTIC MOLDING COMPOSITION ON THE BASIS OF POLY(OXYMETHYLENES), WHICH COMPRISES MIXING (A) FROM 99.9 TO 80 WEIGHT PERCENT OF A LINEAR POLY (OXYMETHYLENE), WHICH MAY CONTAIN UP TO 20 WEIGHT PERCENT, RELATIVE TO THE SAID POLY(OXYMETHYLENE), OF OXYALKYLENE GROUPS HAVING FROM 2 TO 8 ADJACENT CARBON ATOMS, AND (B) FROM 0.01 TO 20 WEIGHT PERCENT OF A POLY(OXYMETHYLENE) CONTAINING FROM 0.1 TO 30 WEIGHT PERCENT, RELATIVE TO THE SAID POLY(OXYMETHYLENE), OF POLYETHER SEGMENTS DERIVED FROM CYCLIC ETHERS HAVING 3 TO 5 RINGMEMBERS AND HAVING A NUMBER AVERAGE MOLECULAR WEIGHT OF AT LEAST 500, AND UP TO 20 WEIGHT PERCENT OF OXYALKYLENE GROUPS HAVING FROM 2 TO 8 ADJACENT CARBON ATOMS, EACH OF THE COMPONENTS BEING IN A PULVERULENT OR GRANULATED FORM AT A TEMPERATURE BELOW 100*C., AND SUBSEQUENTLY MELTING AND HOMOGENIZING THE MIXTURE IN A MIXING DEVICE AT A TEMPERATURE OF FROM 150* TO 250*C., AND THEN REMOVING IT FROM THE MIXING DEVICE.
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