发明授权
- 专利标题： Slotted electrical connector of copperbased alloy separated from an indium coating by a barrier layer
- 专利标题（中）： 由隔离层分离的铜基合金的电镀连接器
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申请号： US29880972申请日： 1972-10-19
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公开(公告)号： US3821692A公开(公告)日： 1974-06-28
- 发明人: BARNARD R
- 申请人： BELL TELEPHONE LABOR INC
- 专利权人： Nokia Bell Labs
- 当前专利权人： Nokia Bell Labs
- 优先权： US29880972 1972-10-19
- 主分类号： H01R4/24
- IPC分类号： H01R4/24 ; H01R4/62 ; H01R11/20
摘要：
Means are disclosed to maintain the long-life resistance characteristics of contacts used in solderless connectors and fabricated from indium plated, copper based alloy. A barrier layer is plated between the alloy of the contact and the indium layer beneficially used with aluminum conductor wire.
公开/授权文献
- USD1046059S1 Snake repeller 公开/授权日：2024-10-08
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