Invention Application
- Patent Title: HIGH-MOLECULAR COMPOUND, MOLDING COMPOSITION, FILM, AND CAPACITOR
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Application No.: US18688731Application Date: 2022-09-02
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Publication No.: US20250026882A1Publication Date: 2025-01-23
- Inventor: Yusuke OGIHARA
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Priority: JP2021-145060 20210906
- International Application: PCT/JP2022/033099 WO 20220902
- Main IPC: C08G63/685
- IPC: C08G63/685 ; C08J5/18 ; H01G4/18

Abstract:
A high-molecular compound has a constitutional unit (U) having a heterocyclic ring, a carbonyl group, and a substituent bonded to the heterocyclic ring. The substituent includes at least one group selected from the group consisting of a halogen group, a hydroxyl group, an aldehyde group, a carboxyl group, an alkyl group, a halogenated alkyl group, and a hydroxyalkyl group.
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