Invention Application
- Patent Title: HIGH-DENSITY ELECTRICAL CONNECTOR
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Application No.: US18759856Application Date: 2024-06-29
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Publication No.: US20250007225A1Publication Date: 2025-01-02
- Inventor: Tyler Yang , Darrell E. Goff , James Alan Dickson , Amarjot Kaur Saggu , Richard John Hoodless , Sunil Rupalia , Christopher Benn , Sam Mclelland , David Wyn Morris
- Applicant: ATL Technology, LLC
- Applicant Address: US UT Springville
- Assignee: ATL Technology, LLC
- Current Assignee: ATL Technology, LLC
- Current Assignee Address: US UT Springville
- Main IPC: H01R24/40
- IPC: H01R24/40 ; H01R12/78 ; H01R13/20 ; H01R13/639 ; H01R107/00

Abstract:
An electrical connector includes a receptacle and a plug. The receptacle includes a first annular flexible circuit board and first electrical contacts coupled to the first annular flexible circuit board, electrically isolated from each other, and arranged in at least one receptacle annular pattern. The plug includes a second annular flexible circuit board and second electrical contacts coupled to the second annular flexible circuit board, electrically isolated from each other, and arranged in at least one plug annular pattern. The plug is selectively connectable with the receptacle. When the plug is selectively connected with the receptacle, each one of the first electrical contacts of the receptacle is in physical contact with a corresponding one of the second electrical contacts of the plug.
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