Invention Application
- Patent Title: CONDUCTIVE MATERIALS FOR DIRECT BONDING
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Application No.: US18391173Application Date: 2023-12-20
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Publication No.: US20250006679A1Publication Date: 2025-01-02
- Inventor: Jeremy Alfred Theil , Cyprian Emeka Uzoh , Guilian Gao , Belgacem Haba , Laura Wills Mirkarimi
- Applicant: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Applicant Address: US CA San Jose
- Assignee: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Current Assignee: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
A structure includes a first substrate including a first layer having at least one electrically conductive first portion and at least one electrically insulative second portion and a second substrate including a second layer having at least one electrically conductive third portion and at least one electrically insulative fourth portion. The structure further includes an interface layer having at least one electrically conductive oxide material between the first layer and the second layer. The at least one electrically conductive oxide material includes at least one first region between and in electrical communication with the at least one electrically conductive first portion and the at least one electrically conductive third portion, and at least one second region between the at least one electrically insulative second portion and the at least one electrically insulative fourth portion.
Information query
IPC分类: