To provide a wavelength variable laser apparatus in which wet-spreading of an adhesive is suppressed when a semiconductor gain chip is mounted on a photonics element with an adhesive. A wavelength variable laser apparatus includes a semiconductor gain chip, a carrier on which the semiconductor gain chip is mounted, and a photonics element adhered to an end surface of the carrier with an adhesive. A lower end part in a longitudinal direction of the semiconductor gain chip is disposed in such a way as to face an upper end part in a longitudinal direction of the photonics element. Discontinuous shapes are formed on an area above a part of the end surface of the carrier to which the adhesive is applied.