Invention Application
- Patent Title: DIP-COAT BINDER SOLUTIONS COMPRISING A DIP-COAT METALLIC PRECURSOR FOR USE IN ADDITIVE MANUFACTURING
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Application No.: US18775499Application Date: 2024-07-17
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Publication No.: US20240367231A1Publication Date: 2024-11-07
- Inventor: Arunkumar Natarajan , Carlos H. Bonilla
- Applicant: General Electric Company
- Applicant Address: US OH Cincinnati
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US OH Cincinnati
- Main IPC: B22F10/16
- IPC: B22F10/16 ; B22F1/103 ; B22F1/105 ; B22F10/62 ; B33Y10/00 ; B33Y70/00

Abstract:
A dip-coat binder solution comprises a dip-coat metallic precursor and a dip-coat binder. The dip-coat binder solution has a viscosity greater than or equal to 1 cP and less than or equal to 150 cP. A method of forming a part includes providing a green body part comprising a plurality of layers of print powder and a print binder, dipping the green body part in a dip-coat binder solution, and heating the dip-coated green body part. The dip-coated green body part is heated to form a coated green body part having a metallic precursor coating on an outer surface of the coated green body part. The coated green body part has a strength greater than or equal to 10 MPa.
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