A modular rear panel system for a chassis of an electronic device includes modular brackets and modular rear panel sections. The brackets are each configured to be selectively coupled to the chassis at a corresponding one of multiple bracket mounting locations. The rear panel sections are each configured to be selectively coupled to one or more corresponding ones of the modular brackets. The brackets and the plurality of rear panel sections comprise, i.e., can be grouped into, multiple different combinations, with each combination comprising a subset of the rear panel sections and subset of the brackets that can be assembled together to form a rear panel of the chassis, with the subset of brackets coupled to the mounting locations and the subset of rear panel sections coupled to the subset of brackets. The respective rear panels formable by the plurality of combinations have mutually different rear panel configurations.