A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip package over and electrically connected to the wiring substrate. The chip package structure includes a first anti-warpage structure bonded to the wiring substrate. The first anti-warpage structure is made of a semiconductor material and electrically insulated from a wiring structure of the wiring substrate and the chip package. The chip package structure includes a heat dissipation structure over the wiring substrate and surrounding the chip package and the first anti-warpage structure.